Component integrity check after disassembly - Acoustic microscopy
Examination by acoustic microscopy to check the process of disassembly of a BGA component of an electronic card.
These images are produced in Emission and in Transmission mode.
We observe on the image by the Emission mode, the presence of an abnormal and extensive white area throughout the component, significant of a delamination at the resin-substrate interface.
Thanks to the transmission image, we can see the presence of an abnormal black area (total attenuation of the acoustic signal) caused by the delaminated area. This debonding is also spread in the die, at the die-attach.
These images confirm a process of dismantling not mastered ("popcorn" effect).