ESREF 2017 - PREDICTIVE IMAGE - Stand 7
A WORD FROM THE CONFERENCE CHAIRS
For this 28th edition, in addition to the core topics of the conference, we have involved the major actors of aeronautics, space and embedded systems industry to provide specific topics such as radiation hardening, very long-term reliability, high/low temperature challenges, obsolescence and counterfeit issues, wide band gap power devices for the more electric aircraft and other embedded system applications.
The main focus in 2017 is reliability assessment of embedded systems in harsh environments required by automotive, avionics and space applications.
On Monday September 25th, two tutorials are offered to allow attendees refreshing and expanding their knowledge on the following topics:
“Simulation of Packaging under Harsh Environment Conditions (Temperature, Pressure, Corrosion and Radiation)” by Kirsten Weide-Zaage, RESRI Group, Institute of Microelectronic Systems (IMS), Leibniz Universität Hannover, 30167 Hannover
“The impacts of EMC/ESD on embedded systems: a challenge for safe systems achievement” by Geneviève Duchamp, IMS Lab - Université de Bordeaux, Fabrice Caignet, LAAS-CNRS Toulouse
Seven Invited speakers who are recognised experts in their fields give an overview of the state-of-the-art and special focus on advanced research work. The key note speech opens the conference on Monday, September 25th. Each invited talk focuses on leading work in the areas of:
Key Note paper “Enabling robust automotive electronic components in advanced CMOS nodes” by Vincent Huard a,*, S. Mhira a,*, F. Cachoa, A. Bravaix*, (a) STMicroelectronics, France, * REER, IM2NP-ISEN, CNRS, France
“Review of the impact of microstructure of lead-free solder joints on assessment of fatigue lives of the solder joints by simulations and thermal cycling tests” by Per-Erik Tegehall, Swerea IVF, Sweden
“Aerospace trends are moving fast towards no more custom ICs to high reliability automotive solutions” by R. Enrici Vaion(a), M. Medda(a), A. Pintus(a), A. Mancaleoni(a), G. Mura(b), (a) STMicroelectronics, Agrate Brianza, (b) University of Cagliari
“Reconsideration of TDDB Reliability of Gate Dielectrics: Mechanisms and Statistics” by Kenji Okada, TowerJazz Panasonic Semiconductor (TPSCo), Japan
“Technologies of IoT - Challenges and Chances for Fault Isolation” by Christian Boit, Technische Universität Berlin, Berlin, Germany
“Reliability and Qualification of Microphotonics for Space Applications - A New Challenge” by Iain McKenzie, ESTEC-European Space Agency, Noordwijck, The Netherlands
A review of Vth instabilities in GaN MISHEMTs by Clemens Ostermaier, Infineon Villach, Germany
Based on an exchange agreement with the committees of the International Symposium on the Physical & Failure Analysis of Integrated Circuits Conference (IPFA 2017), the International Reliability Physics Symposium (IRPS 2017), the authors of awarded papers are invited to present their work at ESREF 2017. These exchanges prove the fruitful collaboration between the Committees of these three conferences.
Exhibition with state-of-art equipment starts on Monday afternoon and hosts coffee breaks, lunches and the poster session to optimise interaction between attendees and exhibitors. Exhibitor flash presentations are scheduled on Tuesday morning and afternoon to allow exhibitors presenting their activity and know-how.
We are looking forward to welcoming you in Bordeaux for a memorable experience !
Nathalie Labat., ESREF 2017 Chair
François Marc, ESREF 2017 Vice-Chair
Hélène Frémont and Marise Bafleur, ESREF 2017 Technical program chairs
Organised by IMS Laboratory, University of Bordeaux