MINAPAD 2018 - Grenoble
Exhibitors and Speakers of this 6th MiNaPAD Forum (Micro/Nano-Electronics Packaging and Assembly, Design ans Manufacturing) will speak about:
- Advanced Packaging : TSV, 2.5D/3D Packaging, FOWLP, WLP, Substrates, Embedded IC packages;
- CAD & tools for I/O placement for advanced packaging, DfR, opto and RF packages design, thermal & mechanical modeling and simulation;
- Digital deep submicron technologies for scaling nodes, MEMS, sensors ans actuators, RF miniaturization, smart system packaging ans heterogeneous integration;
- Innovative packaging for engineering and growing applications
- Materials: adhesives, underfills, molding, dielectrics, etc.;
- Emerging technologies & novels approaches: carbon nano tubes, microfluidics;
- Assembly manufacturing: BGA, CSP, QFN, SiP, cleaning, coating, etc.;
- Reliability, wear out, test and characterization, electromigration, thermal management
- Advanced interconnections: FlipChip, WLP metallurgies, bumping techniques, nontraditinal interconnections, optical connections