Partlab

PartLab

In January 2021, Tame-Component, Elemca and Predictive Image joined in a private partnership called PartLab to combine their know-how and expertise.

While preserving the total independence of each laboratory, this partnership aims to bring together the expertise and skills specific to each one in order to provide an extended technical offer with optimized costs and delivery delays.

The technical offer

Predictive Image remains your single technical contact, and proposes a global offer : we manage the expertises, from components to assembled PCBs. In full transparency, you will be aware of each of the services provided by our partners Elemca and Tame-Component.

Quality engagement

By trusting PartLab, you can rest assured that your quality requirements will be maintained at their highest level. Each of the three laboratories meets the expectations of international standards.

R&D support

  • Electronics & material
  • Construction analysis
  • Reliability analysis
  • Test strategy
  • Thermomechanical simulation
  • Thermomechanical characterization

Material qualification

  • Material characterization
  • Metallurgical and microstructural analysis
  • Chemical, molecular and contamination analysis
  • Thermal characterization
  • Mechanical characterization

Electronic qualification

  • Life Test
  • Electrical characterization
  • Reverse engineering / Process check
  • Upscreening
  • Tests on packages & bondings
  • 2D, 3D X-Ray radiography
  • Acoustic microscopy 3 and 4 axes
  • Assembly qualification IPC-A-610
  • Assembly qualification ECSS-Q-ST-70-38C

Failure analysis

  • Electronics & materials
  • Visual inspection
  • Defect location
  • IR thermography
  • Tomography
  • Construction analysis
  • 2D, 3D X-Ray radiography
  • Acoustic microscopy 3 and 4 axes

Obsolescence management

  • Component condition monitoring system
  • Alert management (Obsolescence, RoHS …)
  • Secure storage
  • Sourcing and qualification of alternative sources
  • Counterfeit detection
  • Recovery of components on board
  • Upscreening RoHS/re-tinning

Counterfeit detection

  • External visual inspection
  • Electrical Test
  • DPA
  • X-Ray
  • Solderability
  • Fluorescence X
  • Construction analysis