Failure analysis - Open and over-consumption - EOS and melted wire bondings - 2D X-Ray radiography

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Radiographic examination conducted as part of a failure analysis on electronic BGA had an electrical fault such as "Open and abnormal electrical consumption" component.
The observed defect is a fusion of several wire bonding and an indication of a close ball bonding (resin amalgam/bonding ball/metallizations?).
Severe EOS could be the cause of this failure.
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