BGA assembly check by 2D X-Ray radiography after board repair - Short defect and balls size inhomogeneity Microelectronics X-Ray Radiography
Component integrity check after disassembly - Acoustic microscopy Microelectronics Acoustic Microscopy
Failure analysis - Open and over-consumption - EOS and melted wire bondings - 2D X-Ray radiography Microelectronics X-Ray Radiography
Failure analysis - Substract defect detected at T0 by 2D X-Ray radiography Microelectronics X-Ray Radiography
Failure analysis Multi-Open - Broken stitch - 2D X-Ray radiography Microelectronics X-Ray Radiography
Failure analysis Open/Short - Fused wire bonding - 2D X-Ray radiography Microelectronics X-Ray Radiography