BGA assembly check by 2D X-Ray radiography after board repair - Short defect and balls size inhomogeneity Microelectronics X-Ray Radiography
Failure analysis - Open and over-consumption - EOS and melted wire bondings - 2D X-Ray radiography Microelectronics X-Ray Radiography
Failure analysis - Substract defect detected at T0 by 2D X-Ray radiography Microelectronics X-Ray Radiography
Failure analysis Multi-Open - Broken stitch - 2D X-Ray radiography Microelectronics X-Ray Radiography
Failure analysis Open/Short - Fused wire bonding - 2D X-Ray radiography Microelectronics X-Ray Radiography
Failure analysis - Defective diode bridge - 2D X-Ray radiography Energy/Petrochemical Industry X-Ray Radiography
Braze control under die - 2D X-Ray Radiography and Acoustic Microscopy Aeronautics/Space Acoustic Microscopy X-Ray Radiography