Failure analysis Multi-Open - Broken stitch - 2D X-Ray radiography

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2D X-ray radiography examination conducted as part of a failure analysis on a BGA component having an electrical default such as "Multi open"

Detection of many wire bonding broken off at the weld of the wire on the bond finger.

This defect appears to be the result of a significant delamination that caused the break of many wires at the Stitchs: "popcorn" effect

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