Failure analysis - Open Pop-corn - BGA - Acoustic Microscopy

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Exam by acoustic microscopy performed through failure analysis "Customer Return" on a BGA component having an electrical failure "Multi open".

For this example, the component has been analyzed in Emission mode for the first 2 images, and in Transmission mode for the last one.

A "popcorn" extended delamination type at the level of the die attach and at the resin / substrate interface  is detected, propagating up to the edge of BGA component, but also at the die-attach as shown in the image done in transmission mode.

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