Braze control under die - 2D X-Ray Radiography and Acoustic Microscopy

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Examinations realized by 2D X-Ray radiography and by Acoustic Microscopy on 2 assemblies with a die embrazed on its substrate.

The purpose of these exams is to verify the presence/absence of lacks and delaminations in the thickness of solder between die and substrate.

An assessment of rate of defects like lacks can be carried out to verify if the assembly responds to customer's criteria in rate of covering of brasure.

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