Failure analysis - Defective diode bridge - 2D X-Ray radiography
Industry :
Control techniques :
Radiographic exam carried out as part of failure analysis on a defective diode bridge module.
On the global images front view and side view, the comparison between the areas "solder chip" left and "solder chip" right highlights anomalies in areas right (signature of abnormal solder inhomogeneous , the presence of darker local indications in front view, the presence of a lighter area in profile ...).
These shots RX and the zoomed images confirm the presence of a defect in the solders areas of the 3 right chips. It appears from these pictures that there was an abnormal "fusion" at zones "right chips".
The failure observed by X-Ray radiography confirms this diode bridge module.
