3D X-Ray tomography optoelectronique assembly
Industry :
Control techniques :
Encapsulated optoelectronic component examen, realized by X-Ray tomography.
The aim is to highlight all the elements of the optoelectronic component through 3D images but also virtual sections.
This 3D X-Ray analysis allows to visualise the chip, its design, bonding wires, the repartition of fibers in epoxy resin.We observe in particular voids in solder and air in the resin.
