3D X-Ray tomography optoelectronique assembly

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Encapsulated optoelectronic component examen, realized by X-Ray tomography.

The aim is to highlight all the elements of the optoelectronic component through 3D images but also virtual sections.

This 3D X-Ray analysis allows to visualise the chip, its design, bonding wires, the repartition of fibers in epoxy resin.We observe in particular voids in solder and air in the resin.

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